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Halation Series
- Module parallel autonomous current sharing structure based on transformer coupling, capable of processing gas flow up to 22SLM at maximum
- Advanced chamber surface facial mask treatment process ensures long-term stable operation of the chamber
- High dissociation rate, effectively improving process efficiency
- Main application process: cleaning
Central Series
- Power range: 10kW-24kW, with a maximum gas processing flow rate of up to 90SLM
- It can efficiently dissociate process gases such as H2 and NF3 while achieving low particulate levels
- Primary application processes: Cleaning, thin film deposition
Major Series
- The use of quartz chambers can efficiently dissociate process gases such as oxygen
- The maximum power can reach 6kW
- High stability of power control, with control accuracy error less than 1%
- Wide ignition window range, supporting multiple processes such as O2-N2 mixing and O2-H2 mixing
- Main application process: debonding
Pilotage Series
- High quality filling of grooves with high aspect ratio can be achieved through the process of low recombination rate cavity surface facial mask layer
- The product structure is highly integrated, with a high degree of visualization of key parameters, and can be flexibly customized and functionally combined according to customer process requirements
- Main application processes: cleaning, film deposition